Yazar
Karagöz, Ayşe, Şengül, Yasemin, Başım, Gül Bahar
Basım Tarihi
2014
Basım Yeri
-
ECS
Konu
Spinodal decomposition, Phase-separation, Optimization
Tür
Süreli Yayın
Dil
İngilizce
Dijital
Evet
Yazma
Hayır
Kütüphane
Özyeğin Üniversitesi
Demirbaş Numarası
1938-5862
Kayıt Numarası
bfbc0672-c0e8-4b76-9ec1-9c3522a2b741
Lokasyon
Natural and Mathematical Sciences, Mechanical Engineering
Tarih
2014
Notlar
Due to copyright restrictions, the access to the full text of this article is only available via subscription.
Örnek Metin
Chemical mechanical planarization (CMP) process enables topographic selectivity through formation of a protective oxide thin film on the recessed locations of the deposited metal layer, while a continuous chemical oxidation reaction is followed by mechanical abrasion takes place on the protruding locations. This paper demonstrates a new approach to CMP process optimization in terms of analyzing the nano-scale surface topography of the protective metal oxide films and modeling their growth through a Cahn-Hilliard equation (CHE) approach as an alternative to classical nucleation theory. It is observed that the material removal rate mechanisms and the consequent planarization performance depend on the nature of nucleation of the metal oxide films, which is a function of the oxidizer concentration of the CMP slurry.
DOI
10.1149/06117.0015ecst
