المؤلف
Karagöz, Ayşe, Şengül, Yasemin, Başım, Gül Bahar
تاريخ النشر
2014
مكان النشر
-
ECS
الموضوع
Spinodal decomposition, Phase-separation, Optimization
النوع
دورية
اللغة
الإنجليزية
رقمي
نعم
مخطوط
لا
المكتبة
جامعة اوزيجين
معرف أصل المكتبة
1938-5862
رقم السجل
bfbc0672-c0e8-4b76-9ec1-9c3522a2b741
موقع المكتبة
Natural and Mathematical Sciences, Mechanical Engineering
التاريخ
2014
ملاحظات
Due to copyright restrictions, the access to the full text of this article is only available via subscription.
نص عينة
Chemical mechanical planarization (CMP) process enables topographic selectivity through formation of a protective oxide thin film on the recessed locations of the deposited metal layer, while a continuous chemical oxidation reaction is followed by mechanical abrasion takes place on the protruding locations. This paper demonstrates a new approach to CMP process optimization in terms of analyzing the nano-scale surface topography of the protective metal oxide films and modeling their growth through a Cahn-Hilliard equation (CHE) approach as an alternative to classical nucleation theory. It is observed that the material removal rate mechanisms and the consequent planarization performance depend on the nature of nucleation of the metal oxide films, which is a function of the oxidizer concentration of the CMP slurry.
DOI
10.1149/06117.0015ecst
