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Conduction-driven cooling of LED-based automotive LED lighting systems for abating local hot spots

Title	Conduction-driven cooling of LED-based automotive LED lighting systems for abating local hot spots
Author	Saati, F., Arık, Mehmet
Publication Date:	2018-02
Publication Place	- SPIE
Subject	Automotive lighting, Light-emitting diode, Local hot spots, Double-sided printed circuit board, Thermal resistance
Type	Periodical
Language	English
Digital	Yes
Manuscript	No
Library:	Özyeğin University
Library Asset ID	0091-3286
Record ID	948b31e0-58c8-4083-93c0-d2448a2f450c
Library Location	Mechanical Engineering
Date	2018-02
Notes	Turkish Ministry of Science, Industry and Technology ; FARBA Corporation ; Ozyegin University
Sample Text	Light-emitting diode (LED)-based automotive lighting systems pose unique challenges, such as dual-side packaging (front side for LEDs and back side for driver electronics circuit), size, harsh ambient, and cooling. Packaging for automotive lighting applications combining the advanced printed circuit board (PCB) technology with a multifunctional LED-based board is investigated with a focus on the effect of thermal conduction-based cooling for hot spot abatement. A baseline study with a flame retardant 4 technology, commonly known as FR4 PCB, is first compared with a metal-core PCB technology, both experimentally and computationally. The double-sided advanced PCB that houses both electronics and LEDs is then investigated computationally and experimentally compared with the baseline FR4 PCB. Computational models are first developed with a commercial computational fluid dynamics software and are followed by an advanced PCB technology based on embedded heat pipes, which is computationally and experimentally studied. Then, attention is turned to studying different heat pipe orientations and heat pipe placements on the board. Results show that conventional FR4-based light engines experience local hot spots (ΔT>50°C) while advanced PCB technology based on heat pipes and thermal spreaders eliminates these local hot spots (ΔT<10°C), leading to a higher lumen extraction with improved reliability. Finally, possible design options are presented with embedded heat pipe structures that further improve the PCB performance.
DOI	10.1117/1.OE.57.2.025102
Cilt	57

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Özyeğin University

Conduction-driven cooling of LED-based automotive LED lighting systems for abating local hot spots

Author Saati, F., Arık, Mehmet

Publication Date 2018-02

Publication Place - SPIE

Subject Automotive lighting, Light-emitting diode, Local hot spots, Double-sided printed circuit board, Thermal resistance

Type Periodical

Language English

Digital Yes

Manuscript No

Library Özyeğin University

Library Asset ID 0091-3286

Record ID 948b31e0-58c8-4083-93c0-d2448a2f450c

Library Location Mechanical Engineering

Date 2018-02

Notes Turkish Ministry of Science, Industry and Technology ; FARBA Corporation ; Ozyegin University

Sample Text Light-emitting diode (LED)-based automotive lighting systems pose unique challenges, such as dual-side packaging (front side for LEDs and back side for driver electronics circuit), size, harsh ambient, and cooling. Packaging for automotive lighting applications combining the advanced printed circuit board (PCB) technology with a multifunctional LED-based board is investigated with a focus on the effect of thermal conduction-based cooling for hot spot abatement. A baseline study with a flame retardant 4 technology, commonly known as FR4 PCB, is first compared with a metal-core PCB technology, both experimentally and computationally. The double-sided advanced PCB that houses both electronics and LEDs is then investigated computationally and experimentally compared with the baseline FR4 PCB. Computational models are first developed with a commercial computational fluid dynamics software and are followed by an advanced PCB technology based on embedded heat pipes, which is computationally and experimentally studied. Then, attention is turned to studying different heat pipe orientations and heat pipe placements on the board. Results show that conventional FR4-based light engines experience local hot spots (ΔT>50°C) while advanced PCB technology based on heat pipes and thermal spreaders eliminates these local hot spots (ΔT<10°C), leading to a higher lumen extraction with improved reliability. Finally, possible design options are presented with embedded heat pipe structures that further improve the PCB performance.

DOI 10.1117/1.OE.57.2.025102

Cilt 57