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Thermal and optical performance characterization of bare and phosphor converted LEDs through package level immersion cooling

Title	Thermal and optical performance characterization of bare and phosphor converted LEDs through package level immersion cooling
Author	Azarifar, Mohammad, Cengiz, Ceren, Arık, Mehmet
Publication Date:	2022-06-15
Publication Place	- Elsevier
Subject	Electronics packaging, LED, Liquid cooling, Optoelectronics thermal management, SSL
Type	Periodical
Language	English
Digital	Yes
Manuscript	No
Library:	Özyeğin University
Library Asset ID	0017-9310
Record ID	beedfe9b-eedf-4c4c-b22f-501fa8c91e58
Library Location	Mechanical Engineering
Date	2022-06-15
Notes	EVATEG Center ; Ozyegin University ; TÜBİTAK
Sample Text	Increased demand for high flux electronics requires creative and affordable thermal management approaches to meet the performance and lifetime expectations. In the present study, optical and thermal improvements of a new package level liquid coolant encapsulation that directly targets heat generation zones are studied for bare and phosphor converted LEDs. As heat both at chip and phosphor composite regions are being generated, a series of detailed experimental and theoretical characterization is performed in order to examine the capability of the new cooling method. The findings can be used to extend the application of precisely controlled liquid packing on the heat source region of optoelectronic components. This method has shown a 15% reduction in thermal resistance and a 7% increase in power conversion efficiency of LED packages. The capacity of this method is mainly limited to the thermal conductivity of the coolant while a significant ability for improvement can be expected by utilizing thermally conductive particles such as hexagonal boron nitride inside the coolant.
DOI	10.1016/j.ijheatmasstransfer.2022.122607
Cilt	189

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Thermal and optical performance characterization of bare and phosphor converted LEDs through package level immersion cooling

Author Azarifar, Mohammad, Cengiz, Ceren, Arık, Mehmet

Publication Date 2022-06-15

Publication Place - Elsevier

Subject Electronics packaging, LED, Liquid cooling, Optoelectronics thermal management, SSL

Type Periodical

Language English

Digital Yes

Manuscript No

Library Özyeğin University

Library Asset ID 0017-9310

Record ID beedfe9b-eedf-4c4c-b22f-501fa8c91e58

Library Location Mechanical Engineering

Date 2022-06-15

Notes EVATEG Center ; Ozyegin University ; TÜBİTAK

Sample Text Increased demand for high flux electronics requires creative and affordable thermal management approaches to meet the performance and lifetime expectations. In the present study, optical and thermal improvements of a new package level liquid coolant encapsulation that directly targets heat generation zones are studied for bare and phosphor converted LEDs. As heat both at chip and phosphor composite regions are being generated, a series of detailed experimental and theoretical characterization is performed in order to examine the capability of the new cooling method. The findings can be used to extend the application of precisely controlled liquid packing on the heat source region of optoelectronic components. This method has shown a 15% reduction in thermal resistance and a 7% increase in power conversion efficiency of LED packages. The capacity of this method is mainly limited to the thermal conductivity of the coolant while a significant ability for improvement can be expected by utilizing thermally conductive particles such as hexagonal boron nitride inside the coolant.

DOI 10.1016/j.ijheatmasstransfer.2022.122607

Cilt 189