Author
Salem, Thamer Khalif, Khosroshahi, F. S., Arık, Mehmet, Hamdan, M. O., Budakli, M.
Publication Date
2019-01-02
Publication Place
-
Taylor & Francis
Subject
Heat pipe, Embedded heat pipe, Thermal conductivity, Printed circuit board, Electronics cooling
Type
Periodical
Language
English
Digital
Yes
Manuscript
No
Library
Özyeğin University
Library Asset ID
0891-6152
Record ID
ae5aa8e1-c908-4f5c-a411-470da3dc9b34
Library Location
Mechanical Engineering
Date
2019-01-02
Notes
Ministry of Science, Industry & Technology - Turkey ; Turkiye Cumhuriyeti Kalkinma Bakanligi ; FARBA Corporation
Sample Text
Thermal management is one of the main issues for electronics cooling especially for tightly packaged PCBs that experience local heat generation. Thus, theoretical and experimental investigations have been conducted to predict thermal performance of a novel heat-pipe-embedded-PCB. First, plain heat-pipe is experimentally tested under various inclination angles and validated by theoretical and numerical calculations. Flattened heat-pipes have been embedded into PCB prototypes made of polymer and aluminum and have been tested for similar experimental parameters; they have shown a decrease in compared with conventional heat pipe. Accordingly, reduction of approximately 50% is achieved for both embedded PCB prototypes.
DOI
10.1080/08916152.2017.1397818
Cilt
32
