Author
Azarifar, M., Arık, Mehmet, Xie, B., Luo, X.
Publication Date
2023-05
Publication Place
-
IEEE
Subject
Heat dissipation, Light-emitting diodes (LEDs), Phase change material (PCM), Thermal quenching
Type
Periodical
Language
English
Digital
Yes
Manuscript
No
Library
Özyeğin University
Library Asset ID
0018-9383
Record ID
28528078-1c85-47ac-b5fd-70108b7610bc
Library Location
Mechanical Engineering
Date
2023-05
Sample Text
A novel concept based on the encapsulation of transparent phase change materials (PCMs) into the optical packaging structure of light-emitting diodes (LEDs) is presented in this article. The concept was initiated by challenges of thermal management of photoluminescent particles in high-power optical systems. LEDs, white LEDs (WLEDs), and porous/network-based photoluminescent matrices can achieve improved thermal networks by embedding PCMs. In this article, paraffin is selected as a suitable PCM encapsulant, and aside from thermal perspectives, an unexpected optical benefit with melted paraffin after surface wetting of the chip was observed. Immersing an LED chip in a melted paraffin pool showed up to an 8% increase in light extraction efficiency and a 1.5% increase in power conversion efficiency (PCE). An accurate dynamic opto-electro-thermal monitoring of studied devices was used to support the proof of concept. This viable method can be integrated into current industrial packaging processes.
DOI
10.1109/TED.2023.3248524
Cilt
70
