Author
Hodes, M. S., Kim, K. J., Arık, Mehmet, Mahajan, R. V., Ramakrishna, K.
Publication Date
2021-11
Publication Place
-
IEEE
Type
Other
Language
English
Digital
Yes
Manuscript
No
Library
Özyeğin University
Library Asset ID
2156-3950
Record ID
de1caddc-5496-4ade-a76d-136fd55cbfa1
Library Location
Mechanical Engineering
Date
2021-11
Sample Text
It has been a little over a year since the passing of Prof. Avram, Avi as he is popularly known, Bar-Cohen. Eulogies from his students and colleagues in the academic, industrial, and government communities in Heat Transfer and Electronics Packaging still continue to come in. His impact on the electronic packaging community in general and thermal management community, in particular, is profound. The IEEE ITherm Conference renamed Best Paper awards in his honor. The ASME InterPACK Conference renamed its Achievement Award to honor him and is working diligently to elevate it from a Divisional Award to a Society-Level Award. The ASME Journal of Electronic Packaging will be publishing a Special Issue, edited mostly by his former students, in December 2021.
Cilt
11
