Author
Hodes, M. S., Iyengar, M., Arık, Mehmet, Kim, K. J., Spector, M., Bhavnani, S. H., Joshi, Y. K., Mahajan, R. V., Ramakrishna, K.
Publication Date
2021-08
Publication Place
-
IEEE
Type
Other
Language
English
Digital
Yes
Manuscript
No
Library
Özyeğin University
Library Asset ID
2156-3950
Record ID
6b16d309-3881-4cb3-9a91-3d799e9bc3fe
Library Location
Mechanical Engineering
Date
2021-08
Sample Text
The outpouring of emotion and appreciation for Prof. Avram (Avi) Bar-Cohen from his students and colleagues in the academic, industrial, and government communities in Heat Transfer and Electronics Packaging is a testament to the truly profound impact that he had on our professional and personal lives. Awards are being renamed in his honor, tributes are pouring in [1], special issues of the IEEE Transactions on Components, Packaging, and Manufacturing Technology (TCPMT) and the ASME Journal of Electronic Packaging are appearing, and articles have been crafted to honor his legacy [2], [3].
Cilt
11
