Author
Tarçın, Hüseyin Gökberk, Saygın, Alper, Muslu, Ahmet Mete, Budakli, M., Arık, Mehmet
Publication Date
2020
Publication Place
-
IEEE
Subject
Photonics, Thermal design, Junction temperature measurement, Forward voltage method, Light emitting diodes
Type
Document
Language
English
Digital
Yes
Manuscript
No
Library
Özyeğin University
Library Asset ID
978-172819764-7
Record ID
6032afc9-eab5-440c-9b83-f899376e262c
Library Location
Mechanical Engineering
Date
2020
Sample Text
Since many industrial applications require heat treatment processes or validation tests under certain ambient temperatures, thermal design is a key issue to be considered in order to ensure fast heating and cooling capabilities. Although most industrial furnaces provide the required isothermal conditions for various test applications or calibrations, a number of them does not provide rapid heating and cooling inside a closed system and the thermal equilibrium over different regions of the system are not satisfied as intended. This brings a number of challenges for the performance test of most electronics, which are affected by ambient temperatures, such as LEDs, lasers and transistors. Particularly, a test environment that can quickly and accurately adjust a uniformly distributed isothermal domain can be useful for many electronic components in order to test their performance at preselected ambient temperatures. In such systems, the design parameters have to be adjusted depending on the desired conditions. In fact, the design of those systems has to be planned in detail to achieve a system working fast and accurate, which shall contribute to reduction in operating time. Therefore, this study focuses on proposing a new approach to the development of a high-performance and high-resolution heating and cooling chamber used in a junction temperature measurement of light emitting diodes (LEDs). The major objective thereby is to achieve high heating and cooling rates of a controlled chamber that satisfies thermal conditions at a user defined temperature interval between 20°C and 80°C. Therefore, material properties and geometrical dimensions, power requirements and cooling performances of the chamber are analyzed as major design parameters. Numerical models are created for various design options, and simulations are performed for various working conditions under certain design constraints. The relationships between design parameters are determined. A final design is propos...
DOI
10.1109/ITherm45881.2020.9190588
