In memoriam Prof. Avram Bar-Cohen

Name: In memoriam Prof. Avram Bar-Cohen
Author: Hodes, M. S., Kim, K. J., Arık, Mehmet, Mahajan, R. V., Ramakrishna, K.

İsim	In memoriam Prof. Avram Bar-Cohen
Yazar	Hodes, M. S., Kim, K. J., Arık, Mehmet, Mahajan, R. V., Ramakrishna, K.
Basım Tarihi:	2021-11
Basım Yeri	- IEEE
Tür	Diğer
Dil	İngilizce
Dijital	Evet
Yazma	Hayır
Kütüphane:	Özyeğin Üniversitesi
Demirbaş Numarası	2156-3950
Kayıt Numarası	de1caddc-5496-4ade-a76d-136fd55cbfa1
Lokasyon	Mechanical Engineering
Tarih	2021-11
Örnek Metin	It has been a little over a year since the passing of Prof. Avram, Avi as he is popularly known, Bar-Cohen. Eulogies from his students and colleagues in the academic, industrial, and government communities in Heat Transfer and Electronics Packaging still continue to come in. His impact on the electronic packaging community in general and thermal management community, in particular, is profound. The IEEE ITherm Conference renamed Best Paper awards in his honor. The ASME InterPACK Conference renamed its Achievement Award to honor him and is working diligently to elevate it from a Divisional Award to a Society-Level Award. The ASME Journal of Electronic Packaging will be publishing a Special Issue, edited mostly by his former students, in December 2021.
Cilt	11

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In memoriam Prof. Avram Bar-Cohen

Yazar Hodes, M. S., Kim, K. J., Arık, Mehmet, Mahajan, R. V., Ramakrishna, K.

Basım Tarihi 2021-11

Basım Yeri - IEEE

Tür Diğer

Dil İngilizce

Dijital Evet

Yazma Hayır

Kütüphane Özyeğin Üniversitesi

Demirbaş Numarası 2156-3950

Kayıt Numarası de1caddc-5496-4ade-a76d-136fd55cbfa1

Lokasyon Mechanical Engineering

Tarih 2021-11

Örnek Metin It has been a little over a year since the passing of Prof. Avram, Avi as he is popularly known, Bar-Cohen. Eulogies from his students and colleagues in the academic, industrial, and government communities in Heat Transfer and Electronics Packaging still continue to come in. His impact on the electronic packaging community in general and thermal management community, in particular, is profound. The IEEE ITherm Conference renamed Best Paper awards in his honor. The ASME InterPACK Conference renamed its Achievement Award to honor him and is working diligently to elevate it from a Divisional Award to a Society-Level Award. The ASME Journal of Electronic Packaging will be publishing a Special Issue, edited mostly by his former students, in December 2021.

Cilt 11