In memoriam Prof. Avram Bar-Cohen

Name: In memoriam Prof. Avram Bar-Cohen
Author: Hodes, M. S., Iyengar, M., Arık, Mehmet, Kim, K. J., Spector, M., Bhavnani, S. H., Joshi, Y. K., Mahajan, R. V., Ramakrishna, K.

İsim	In memoriam Prof. Avram Bar-Cohen
Yazar	Hodes, M. S., Iyengar, M., Arık, Mehmet, Kim, K. J., Spector, M., Bhavnani, S. H., Joshi, Y. K., Mahajan, R. V., Ramakrishna, K.
Basım Tarihi:	2021-08
Basım Yeri	- IEEE
Tür	Diğer
Dil	İngilizce
Dijital	Evet
Yazma	Hayır
Kütüphane:	Özyeğin Üniversitesi
Demirbaş Numarası	2156-3950
Kayıt Numarası	6b16d309-3881-4cb3-9a91-3d799e9bc3fe
Lokasyon	Mechanical Engineering
Tarih	2021-08
Örnek Metin	The outpouring of emotion and appreciation for Prof. Avram (Avi) Bar-Cohen from his students and colleagues in the academic, industrial, and government communities in Heat Transfer and Electronics Packaging is a testament to the truly profound impact that he had on our professional and personal lives. Awards are being renamed in his honor, tributes are pouring in [1], special issues of the IEEE Transactions on Components, Packaging, and Manufacturing Technology (TCPMT) and the ASME Journal of Electronic Packaging are appearing, and articles have been crafted to honor his legacy [2], [3].
Cilt	11

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In memoriam Prof. Avram Bar-Cohen

Yazar Hodes, M. S., Iyengar, M., Arık, Mehmet, Kim, K. J., Spector, M., Bhavnani, S. H., Joshi, Y. K., Mahajan, R. V., Ramakrishna, K.

Basım Tarihi 2021-08

Basım Yeri - IEEE

Tür Diğer

Dil İngilizce

Dijital Evet

Yazma Hayır

Kütüphane Özyeğin Üniversitesi

Demirbaş Numarası 2156-3950

Kayıt Numarası 6b16d309-3881-4cb3-9a91-3d799e9bc3fe

Lokasyon Mechanical Engineering

Tarih 2021-08

Örnek Metin The outpouring of emotion and appreciation for Prof. Avram (Avi) Bar-Cohen from his students and colleagues in the academic, industrial, and government communities in Heat Transfer and Electronics Packaging is a testament to the truly profound impact that he had on our professional and personal lives. Awards are being renamed in his honor, tributes are pouring in [1], special issues of the IEEE Transactions on Components, Packaging, and Manufacturing Technology (TCPMT) and the ASME Journal of Electronic Packaging are appearing, and articles have been crafted to honor his legacy [2], [3].

Cilt 11