Effect of slurry aging on stability and performance of chemical mechanical planarization process

Name: Effect of slurry aging on stability and performance of chemical mechanical planarization process
Author: Başım, Gül Bahar

İsim	Effect of slurry aging on stability and performance of chemical mechanical planarization process
Yazar	Başım, Gül Bahar
Basım Tarihi:	2011-03
Basım Yeri	- Elsevier
Konu	Chemical mechanical planarization (CMP), Slurry aging, Agglomeration, Biocide, Extreme stabilization
Tür	Süreli Yayın
Dil	İngilizce
Dijital	Evet
Yazma	Hayır
Kütüphane:	Özyeğin Üniversitesi
Demirbaş Numarası	0921-8831
Kayıt Numarası	1330ed58-f0a8-4409-aacc-3594982d10fc
Lokasyon	Mechanical Engineering
Tarih	2011-03
Notlar	Due to copyright restrictions, the access to the full text of this article is only available via subscription.
Örnek Metin	Chemical mechanical planarization (CMP) is known to be one of the most challenging processes in microelectronics manufacturing due to the number of variables involved in the design of the process. In particular, the slurries made of nano-sized particles and aggressive chemistries need to be characterized batch to batch and as a function of time to enable robust high volume manufacturing. In this study, the effect of slurry aging on CMP performance was investigated systematically for regular silica based slurry as well as for slurry containing an organic biocide additive to prevent bacteria formation. The parameters examined were particle size distribution, zeta potential, bacteria count, total organic carbon concentration, silicon ion dissolution, material removal rate (MRR), and surface quality. The results indicated that aging influenced slurry performance negatively and even with the addition of biocide, organic contamination was observed at the extended aging periods. The material removal rates decreased significantly by aging and more surface deformations were observed on the wafer surfaces polished with the slurries destabilized with the elapsed time. Slurries containing biocide were detected to be more prone to agglomeration and increase in particle size as the time passes after the slurry is exposed to the environment. Furthermore, the impact of short time slurry aging (conditioning) on particle properties of the slurries containing polymeric additives and the adverse affects of extreme stability in the slurries containing surfactants are also discussed in terms of the two other factors that can cause variability in CMP slurry performance.
DOI	10.1016/j.apt.2011.02.002
Cilt	22

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Effect of slurry aging on stability and performance of chemical mechanical planarization process

Yazar Başım, Gül Bahar

Basım Tarihi 2011-03

Basım Yeri - Elsevier

Konu Chemical mechanical planarization (CMP), Slurry aging, Agglomeration, Biocide, Extreme stabilization

Tür Süreli Yayın

Dil İngilizce

Dijital Evet

Yazma Hayır

Kütüphane Özyeğin Üniversitesi

Demirbaş Numarası 0921-8831

Kayıt Numarası 1330ed58-f0a8-4409-aacc-3594982d10fc

Lokasyon Mechanical Engineering

Tarih 2011-03

Notlar Due to copyright restrictions, the access to the full text of this article is only available via subscription.

Örnek Metin Chemical mechanical planarization (CMP) is known to be one of the most challenging processes in microelectronics manufacturing due to the number of variables involved in the design of the process. In particular, the slurries made of nano-sized particles and aggressive chemistries need to be characterized batch to batch and as a function of time to enable robust high volume manufacturing. In this study, the effect of slurry aging on CMP performance was investigated systematically for regular silica based slurry as well as for slurry containing an organic biocide additive to prevent bacteria formation. The parameters examined were particle size distribution, zeta potential, bacteria count, total organic carbon concentration, silicon ion dissolution, material removal rate (MRR), and surface quality. The results indicated that aging influenced slurry performance negatively and even with the addition of biocide, organic contamination was observed at the extended aging periods. The material removal rates decreased significantly by aging and more surface deformations were observed on the wafer surfaces polished with the slurries destabilized with the elapsed time. Slurries containing biocide were detected to be more prone to agglomeration and increase in particle size as the time passes after the slurry is exposed to the environment. Furthermore, the impact of short time slurry aging (conditioning) on particle properties of the slurries containing polymeric additives and the adverse affects of extreme stability in the slurries containing surfactants are also discussed in terms of the two other factors that can cause variability in CMP slurry performance.

DOI 10.1016/j.apt.2011.02.002

Cilt 22