Conduction-driven cooling of LED-based automotive LED lighting systems for abating local hot spots

Name: Conduction-driven cooling of LED-based automotive LED lighting systems for abating local hot spots
Author: Saati, F., Arık, Mehmet

İsim	Conduction-driven cooling of LED-based automotive LED lighting systems for abating local hot spots
Yazar	Saati, F., Arık, Mehmet
Basım Tarihi:	2018-02
Basım Yeri	- SPIE
Konu	Automotive lighting, Light-emitting diode, Local hot spots, Double-sided printed circuit board, Thermal resistance
Tür	Süreli Yayın
Dil	İngilizce
Dijital	Evet
Yazma	Hayır
Kütüphane:	Özyeğin Üniversitesi
Demirbaş Numarası	0091-3286
Kayıt Numarası	948b31e0-58c8-4083-93c0-d2448a2f450c
Lokasyon	Mechanical Engineering
Tarih	2018-02
Notlar	Turkish Ministry of Science, Industry and Technology ; FARBA Corporation ; Ozyegin University
Örnek Metin	Light-emitting diode (LED)-based automotive lighting systems pose unique challenges, such as dual-side packaging (front side for LEDs and back side for driver electronics circuit), size, harsh ambient, and cooling. Packaging for automotive lighting applications combining the advanced printed circuit board (PCB) technology with a multifunctional LED-based board is investigated with a focus on the effect of thermal conduction-based cooling for hot spot abatement. A baseline study with a flame retardant 4 technology, commonly known as FR4 PCB, is first compared with a metal-core PCB technology, both experimentally and computationally. The double-sided advanced PCB that houses both electronics and LEDs is then investigated computationally and experimentally compared with the baseline FR4 PCB. Computational models are first developed with a commercial computational fluid dynamics software and are followed by an advanced PCB technology based on embedded heat pipes, which is computationally and experimentally studied. Then, attention is turned to studying different heat pipe orientations and heat pipe placements on the board. Results show that conventional FR4-based light engines experience local hot spots (ΔT>50°C) while advanced PCB technology based on heat pipes and thermal spreaders eliminates these local hot spots (ΔT<10°C), leading to a higher lumen extraction with improved reliability. Finally, possible design options are presented with embedded heat pipe structures that further improve the PCB performance.
DOI	10.1117/1.OE.57.2.025102
Cilt	57

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Conduction-driven cooling of LED-based automotive LED lighting systems for abating local hot spots

Yazar Saati, F., Arık, Mehmet

Basım Tarihi 2018-02

Basım Yeri - SPIE

Konu Automotive lighting, Light-emitting diode, Local hot spots, Double-sided printed circuit board, Thermal resistance

Tür Süreli Yayın

Dil İngilizce

Dijital Evet

Yazma Hayır

Kütüphane Özyeğin Üniversitesi

Demirbaş Numarası 0091-3286

Kayıt Numarası 948b31e0-58c8-4083-93c0-d2448a2f450c

Lokasyon Mechanical Engineering

Tarih 2018-02

Notlar Turkish Ministry of Science, Industry and Technology ; FARBA Corporation ; Ozyegin University

Örnek Metin Light-emitting diode (LED)-based automotive lighting systems pose unique challenges, such as dual-side packaging (front side for LEDs and back side for driver electronics circuit), size, harsh ambient, and cooling. Packaging for automotive lighting applications combining the advanced printed circuit board (PCB) technology with a multifunctional LED-based board is investigated with a focus on the effect of thermal conduction-based cooling for hot spot abatement. A baseline study with a flame retardant 4 technology, commonly known as FR4 PCB, is first compared with a metal-core PCB technology, both experimentally and computationally. The double-sided advanced PCB that houses both electronics and LEDs is then investigated computationally and experimentally compared with the baseline FR4 PCB. Computational models are first developed with a commercial computational fluid dynamics software and are followed by an advanced PCB technology based on embedded heat pipes, which is computationally and experimentally studied. Then, attention is turned to studying different heat pipe orientations and heat pipe placements on the board. Results show that conventional FR4-based light engines experience local hot spots (ΔT>50°C) while advanced PCB technology based on heat pipes and thermal spreaders eliminates these local hot spots (ΔT<10°C), leading to a higher lumen extraction with improved reliability. Finally, possible design options are presented with embedded heat pipe structures that further improve the PCB performance.

DOI 10.1117/1.OE.57.2.025102

Cilt 57