Numerical and experimental analysis of a heat-pipe-embedded printed circuit board for solid state lighting applications

Name: Numerical and experimental analysis of a heat-pipe-embedded printed circuit board for solid state lighting applications
Author: Salem, Thamer Khalif, Khosroshahi, F. S., Arık, Mehmet, Hamdan, M. O., Budakli, M.

İsim	Numerical and experimental analysis of a heat-pipe-embedded printed circuit board for solid state lighting applications
Yazar	Salem, Thamer Khalif, Khosroshahi, F. S., Arık, Mehmet, Hamdan, M. O., Budakli, M.
Basım Tarihi:	2019-01-02
Basım Yeri	- Taylor & Francis
Konu	Heat pipe, Embedded heat pipe, Thermal conductivity, Printed circuit board, Electronics cooling
Tür	Süreli Yayın
Dil	İngilizce
Dijital	Evet
Yazma	Hayır
Kütüphane:	Özyeğin Üniversitesi
Demirbaş Numarası	0891-6152
Kayıt Numarası	ae5aa8e1-c908-4f5c-a411-470da3dc9b34
Lokasyon	Mechanical Engineering
Tarih	2019-01-02
Notlar	Ministry of Science, Industry & Technology - Turkey ; Turkiye Cumhuriyeti Kalkinma Bakanligi ; FARBA Corporation
Örnek Metin	Thermal management is one of the main issues for electronics cooling especially for tightly packaged PCBs that experience local heat generation. Thus, theoretical and experimental investigations have been conducted to predict thermal performance of a novel heat-pipe-embedded-PCB. First, plain heat-pipe is experimentally tested under various inclination angles and validated by theoretical and numerical calculations. Flattened heat-pipes have been embedded into PCB prototypes made of polymer and aluminum and have been tested for similar experimental parameters; they have shown a decrease in compared with conventional heat pipe. Accordingly, reduction of approximately 50% is achieved for both embedded PCB prototypes.
DOI	10.1080/08916152.2017.1397818
Cilt	32

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Numerical and experimental analysis of a heat-pipe-embedded printed circuit board for solid state lighting applications

Yazar Salem, Thamer Khalif, Khosroshahi, F. S., Arık, Mehmet, Hamdan, M. O., Budakli, M.

Basım Tarihi 2019-01-02

Basım Yeri - Taylor & Francis

Konu Heat pipe, Embedded heat pipe, Thermal conductivity, Printed circuit board, Electronics cooling

Tür Süreli Yayın

Dil İngilizce

Dijital Evet

Yazma Hayır

Kütüphane Özyeğin Üniversitesi

Demirbaş Numarası 0891-6152

Kayıt Numarası ae5aa8e1-c908-4f5c-a411-470da3dc9b34

Lokasyon Mechanical Engineering

Tarih 2019-01-02

Notlar Ministry of Science, Industry & Technology - Turkey ; Turkiye Cumhuriyeti Kalkinma Bakanligi ; FARBA Corporation

Örnek Metin Thermal management is one of the main issues for electronics cooling especially for tightly packaged PCBs that experience local heat generation. Thus, theoretical and experimental investigations have been conducted to predict thermal performance of a novel heat-pipe-embedded-PCB. First, plain heat-pipe is experimentally tested under various inclination angles and validated by theoretical and numerical calculations. Flattened heat-pipes have been embedded into PCB prototypes made of polymer and aluminum and have been tested for similar experimental parameters; they have shown a decrease in compared with conventional heat pipe. Accordingly, reduction of approximately 50% is achieved for both embedded PCB prototypes.

DOI 10.1080/08916152.2017.1397818

Cilt 32