Thermal and optical characterization of white and blue multi-chip LED light engines

Name: Thermal and optical characterization of white and blue multi-chip LED light engines
Author: Cengiz, Ceren, Azarifar, Mohammad, Arık, Mehmet

İsim	Thermal and optical characterization of white and blue multi-chip LED light engines
Yazar	Cengiz, Ceren, Azarifar, Mohammad, Arık, Mehmet
Basım Tarihi:	2021
Basım Yeri	- IEEE
Konu	Forward voltage, Junction temperature measurement, MR16 LED lamp, Multi-chip LEDs, Optical power, Spectral distribution, White LEDs
Tür	Belge
Dil	İngilizce
Dijital	Evet
Yazma	Hayır
Kütüphane:	Özyeğin Üniversitesi
Demirbaş Numarası	978-172818539-2
Kayıt Numarası	5819a6d1-72f6-4f2c-a271-bd8aa643899a
Lokasyon	Mechanical Engineering
Tarih	2021
Örnek Metin	A clear understanding of thermal characteristics for light emitting diodes (LEDs) is at the center of attention for lighting industry. Especially accurate evaluation of the junction temperature of various light engines is the subject matter for last two decades. Nonetheless, viability of the priorly offered solutions is still an argument and only a few of them are practical enough for the extensive practices. Therefore, in this research, utilization of a new multi-LED chip junction temperature measurement technique is studied through thermal characterization of a commercially available MR16 solid-state light lamp. In order to increase the precision of junction temperature measurement for complex LED structures, a newly proposed methodology is applied simultaneously for each LED chip and temperatures of the multi-LED system at each location are determined. Experimental analysis conducted using an advanced junction temperature measurement device that practices the inverse relationship between Forward Voltage (FV) and Junction Temperature (Tj) considering the three-dimensional heat flow from the p-n junction region. Validation of the above-stated measurement device is performed via local temperature maps captured by using an Infrared (IR) thermal camera and detailed CFD numerical models of each LED package is built with commercially available softwares. Optical measurements are then performed, and relevant thermo-optical relationships are established. Findings presented in this paper shown that augmented multi-chip junction temperature measurement method is a promising solution to measure temperature of complex multi-LED devices. In virtue of the established approach, thermal degradation and optical performance assessments of different types of light engines can be accomplished extensively. In future studies, junction temperature data gathered from various multi-LED light engines can be optimized to form a temperature predictive analytical models that can offer a new perspective for the advanced technological applications.
DOI	10.1109/ITherm51669.2021.9503203

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Thermal and optical characterization of white and blue multi-chip LED light engines

Yazar Cengiz, Ceren, Azarifar, Mohammad, Arık, Mehmet

Basım Tarihi 2021

Basım Yeri - IEEE

Konu Forward voltage, Junction temperature measurement, MR16 LED lamp, Multi-chip LEDs, Optical power, Spectral distribution, White LEDs

Tür Belge

Dil İngilizce

Dijital Evet

Yazma Hayır

Kütüphane Özyeğin Üniversitesi

Demirbaş Numarası 978-172818539-2

Kayıt Numarası 5819a6d1-72f6-4f2c-a271-bd8aa643899a

Lokasyon Mechanical Engineering

Tarih 2021

Örnek Metin A clear understanding of thermal characteristics for light emitting diodes (LEDs) is at the center of attention for lighting industry. Especially accurate evaluation of the junction temperature of various light engines is the subject matter for last two decades. Nonetheless, viability of the priorly offered solutions is still an argument and only a few of them are practical enough for the extensive practices. Therefore, in this research, utilization of a new multi-LED chip junction temperature measurement technique is studied through thermal characterization of a commercially available MR16 solid-state light lamp. In order to increase the precision of junction temperature measurement for complex LED structures, a newly proposed methodology is applied simultaneously for each LED chip and temperatures of the multi-LED system at each location are determined. Experimental analysis conducted using an advanced junction temperature measurement device that practices the inverse relationship between Forward Voltage (FV) and Junction Temperature (Tj) considering the three-dimensional heat flow from the p-n junction region. Validation of the above-stated measurement device is performed via local temperature maps captured by using an Infrared (IR) thermal camera and detailed CFD numerical models of each LED package is built with commercially available softwares. Optical measurements are then performed, and relevant thermo-optical relationships are established. Findings presented in this paper shown that augmented multi-chip junction temperature measurement method is a promising solution to measure temperature of complex multi-LED devices. In virtue of the established approach, thermal degradation and optical performance assessments of different types of light engines can be accomplished extensively. In future studies, junction temperature data gathered from various multi-LED light engines can be optimized to form a temperature predictive analytical models that can offer a new perspective for the advanced technological applications.

DOI 10.1109/ITherm51669.2021.9503203