A computational and experimental study on a harsh environment LED system for vehicle exterior lighting applications

Name: A computational and experimental study on a harsh environment LED system for vehicle exterior lighting applications
Author: Saati Khosroshahi, Ferina, Tüfekçi, C. S., Arık, Mehmet

İsim	A computational and experimental study on a harsh environment LED system for vehicle exterior lighting applications
Yazar	Saati Khosroshahi, Ferina, Tüfekçi, C. S., Arık, Mehmet
Basım Tarihi:	2014
Basım Yeri	- IEEE
Konu	Automotive, Light emitting diode, Single LED package, Conduction, Junction to solder point resistance, Junction to ambient resistance, System modeling
Tür	Belge
Dil	İngilizce
Dijital	Evet
Yazma	Hayır
Kütüphane:	Özyeğin Üniversitesi
Demirbaş Numarası	978-1-4799-5267-0
Kayıt Numarası	bd67d856-5e68-4c1c-bc7b-dce659b1ee9d
Lokasyon	Mechanical Engineering
Tarih	2014
Notlar	Due to copyright restrictions, the access to the full text of this article is only available via subscription.
Örnek Metin	Effect of compact thermal packaging approaches and challenges are investigated for a next generation automotive LED lighting. A challenging three-purpose in one (3i1) highly packaged light emitting diodes (LEDs) lighting system has been studied computationally and experimentally. A tightly packed light engine printed circuit board (PCB) with both LEDs and electronics in a very hermetically sealed enclosure close to the vehicle engine department pose significant thermal and mechanical challenges for the thermal design as well as optical considerations. Challenge is due to local high ambient temperatures and aggressive operating conditions. Finite element based computational models have been developed first to study a single package thermal performance, and then followed by system level computational fluid dynamics (CFD) models. Later, a series of experiments and analytical studies have been performed for validation of computational results. It is found that interface layer at the package poses significant bottlenecks for meeting the design requirements. System level CFD models showed that having a two-sided flame retardant (FR4) based board causes local hot spots that need innovative system level cooling solutions.
DOI	10.1109/ITHERM.2014.6892262

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A computational and experimental study on a harsh environment LED system for vehicle exterior lighting applications

Yazar Saati Khosroshahi, Ferina, Tüfekçi, C. S., Arık, Mehmet

Basım Tarihi 2014

Basım Yeri - IEEE

Konu Automotive, Light emitting diode, Single LED package, Conduction, Junction to solder point resistance, Junction to ambient resistance, System modeling

Tür Belge

Dil İngilizce

Dijital Evet

Yazma Hayır

Kütüphane Özyeğin Üniversitesi

Demirbaş Numarası 978-1-4799-5267-0

Kayıt Numarası bd67d856-5e68-4c1c-bc7b-dce659b1ee9d

Lokasyon Mechanical Engineering

Tarih 2014

Notlar Due to copyright restrictions, the access to the full text of this article is only available via subscription.

Örnek Metin Effect of compact thermal packaging approaches and challenges are investigated for a next generation automotive LED lighting. A challenging three-purpose in one (3i1) highly packaged light emitting diodes (LEDs) lighting system has been studied computationally and experimentally. A tightly packed light engine printed circuit board (PCB) with both LEDs and electronics in a very hermetically sealed enclosure close to the vehicle engine department pose significant thermal and mechanical challenges for the thermal design as well as optical considerations. Challenge is due to local high ambient temperatures and aggressive operating conditions. Finite element based computational models have been developed first to study a single package thermal performance, and then followed by system level computational fluid dynamics (CFD) models. Later, a series of experiments and analytical studies have been performed for validation of computational results. It is found that interface layer at the package poses significant bottlenecks for meeting the design requirements. System level CFD models showed that having a two-sided flame retardant (FR4) based board causes local hot spots that need innovative system level cooling solutions.

DOI 10.1109/ITHERM.2014.6892262