Biomaterials applications of chemical mechanical polishing

Name: Biomaterials applications of chemical mechanical polishing
Author: Başım, Gül Bahar, Özdemir, Zeynep, Mutlu, Ö.

İsim	Biomaterials applications of chemical mechanical polishing
Yazar	Başım, Gül Bahar, Özdemir, Zeynep, Mutlu, Ö.
Basım Tarihi:	2012
Basım Yeri	- IEEE
Konu	CMP, Titanium implants, Biomaterials, Micro-patterning
Tür	Belge
Dil	İngilizce
Dijital	Evet
Yazma	Hayır
Kütüphane:	Özyeğin Üniversitesi
Demirbaş Numarası	978-3-8007-3452-8
Kayıt Numarası	e1a08db9-cd91-449d-9eb8-1f2ea356cfa4
Lokasyon	Mechanical Engineering
Tarih	2012
Notlar	Due to copyright restrictions, the access to the full text of this article is only available via subscription.
Örnek Metin	Chemical Mechanical Polishing (CMP) is used in semiconductor industry to enable planarization of the interlayer dielectrics and metals. In this study, CMP is used as a polishing technique to modify the surface roughness of the bio-implant materials in a controlled manner. As an alternative technique to sand-blasting/etching or laser structuring on the implant surfaces, CMP results in formation of a protective oxide layer on the titanium surfaces that can limit surface contamination while enabling surface nano-structuring that is known to promote bioactivity. Keywords: CMP, Titanium Implants, Biomaterials, Micro-Patterning.

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Özyeğin Üniversitesi

Kaynağa git

Biomaterials applications of chemical mechanical polishing

Yazar Başım, Gül Bahar, Özdemir, Zeynep, Mutlu, Ö.

Basım Tarihi 2012

Basım Yeri - IEEE

Konu CMP, Titanium implants, Biomaterials, Micro-patterning

Tür Belge

Dil İngilizce

Dijital Evet

Yazma Hayır

Kütüphane Özyeğin Üniversitesi

Demirbaş Numarası 978-3-8007-3452-8

Kayıt Numarası e1a08db9-cd91-449d-9eb8-1f2ea356cfa4

Lokasyon Mechanical Engineering

Tarih 2012

Notlar Due to copyright restrictions, the access to the full text of this article is only available via subscription.

Örnek Metin Chemical Mechanical Polishing (CMP) is used in semiconductor industry to enable planarization of the interlayer dielectrics and metals. In this study, CMP is used as a polishing technique to modify the surface roughness of the bio-implant materials in a controlled manner. As an alternative technique to sand-blasting/etching or laser structuring on the implant surfaces, CMP results in formation of a protective oxide layer on the titanium surfaces that can limit surface contamination while enabling surface nano-structuring that is known to promote bioactivity. Keywords: CMP, Titanium Implants, Biomaterials, Micro-Patterning.