Author
Başım, Gül Bahar, Özdemir, Zeynep, Mutlu, Ö.
Publication Date
2012
Publication Place
-
IEEE
Subject
CMP, Titanium implants, Biomaterials, Micro-patterning
Type
Document
Language
English
Digital
Yes
Manuscript
No
Library
Özyeğin University
Library Asset ID
978-3-8007-3452-8
Record ID
e1a08db9-cd91-449d-9eb8-1f2ea356cfa4
Library Location
Mechanical Engineering
Date
2012
Notes
Due to copyright restrictions, the access to the full text of this article is only available via subscription.
Sample Text
Chemical Mechanical Polishing (CMP) is used in semiconductor industry to enable planarization of the interlayer dielectrics and metals. In this study, CMP is used as a polishing technique to modify the surface roughness of the bio-implant materials in a controlled manner. As an alternative technique to sand-blasting/etching or laser structuring on the implant surfaces, CMP results in formation of a protective oxide layer on the titanium surfaces that can limit surface contamination while enabling surface nano-structuring that is known to promote bioactivity. Keywords: CMP, Titanium Implants, Biomaterials, Micro-Patterning.