MIComp: 3D on-chip magneto-inductive computing with simultaneous wireless information and power transfer

Name: MIComp: 3D on-chip magneto-inductive computing with simultaneous wireless information and power transfer
Author: Gülbahar, Burhan, Memişoğlu, G.

İsim	MIComp: 3D on-chip magneto-inductive computing with simultaneous wireless information and power transfer
Yazar	Gülbahar, Burhan, Memişoğlu, G.
Basım Tarihi:	2018-05-08
Basım Yeri	- Association for Computing Machinery, Inc
Konu	Magneto-inductive computing, 3D on-chip communications, Simultaneous wireless information and power transfer
Tür	Belge
Dil	İngilizce
Dijital	Evet
Yazma	Hayır
Kütüphane:	Özyeğin Üniversitesi
Demirbaş Numarası	978-145035761-6
Kayıt Numarası	1063300c-8dfc-47e1-9ce0-59f1f0279418
Lokasyon	Electrical & Electronics Engineering
Tarih	2018-05-08
Örnek Metin	On-chip computing platforms have bottlenecks including cost and physical limits of scaling transistors, communication bottleneck, energy efficiency and speed costs for memory. Three dimensional (3D) design, carbon nanotube materials, memristor based neuromorphic computing, and optical, RF and magneto-inductive (MI) wireless communication solutions are recently proposed. MI channels are non-radiative and non-interfering by forming coupled networks. They are future promising with capabilities of THz frequency, Tbit/s data rate, hundreds of zJ/bit and 109 W/mm2 communication and power transfer (PT) efficiencies, respectively. In addition, recently introduced network topology modulation (NTM) for MI channels provides network communication with low complexity, low latency and simultaneous wireless information and power transfer (SWIPT). In this article, unique advantages of THz MI channels, NTM design, nanoscale materials including graphene and single molecular magnets (SMMs), and 3D design are combined in a novel on-chip computing architecture denoted by MIComp by introducing fully efficient SWIPT for computing purposes. The system is theoretically modeled while the state space of the system obtained with nanoscale size coils and SMMs achieves 1010 to 1016 bits in each cycle and per mm3 volume of chip compared with the current transistor counts of on the orders of 109 per mm2. Furthermore, each MIComp cycle has ability to perform for multiple purposes consisting of computing operations, memory state implementations and on-chip communications. It promises a novel solution for communication, energy and space bottlenecks for on-chip computing design.
DOI	10.1145/3203217.3203281

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MIComp: 3D on-chip magneto-inductive computing with simultaneous wireless information and power transfer

Yazar Gülbahar, Burhan, Memişoğlu, G.

Basım Tarihi 2018-05-08

Basım Yeri - Association for Computing Machinery, Inc

Konu Magneto-inductive computing, 3D on-chip communications, Simultaneous wireless information and power transfer

Tür Belge

Dil İngilizce

Dijital Evet

Yazma Hayır

Kütüphane Özyeğin Üniversitesi

Demirbaş Numarası 978-145035761-6

Kayıt Numarası 1063300c-8dfc-47e1-9ce0-59f1f0279418

Lokasyon Electrical & Electronics Engineering

Tarih 2018-05-08

Örnek Metin On-chip computing platforms have bottlenecks including cost and physical limits of scaling transistors, communication bottleneck, energy efficiency and speed costs for memory. Three dimensional (3D) design, carbon nanotube materials, memristor based neuromorphic computing, and optical, RF and magneto-inductive (MI) wireless communication solutions are recently proposed. MI channels are non-radiative and non-interfering by forming coupled networks. They are future promising with capabilities of THz frequency, Tbit/s data rate, hundreds of zJ/bit and 109 W/mm2 communication and power transfer (PT) efficiencies, respectively. In addition, recently introduced network topology modulation (NTM) for MI channels provides network communication with low complexity, low latency and simultaneous wireless information and power transfer (SWIPT). In this article, unique advantages of THz MI channels, NTM design, nanoscale materials including graphene and single molecular magnets (SMMs), and 3D design are combined in a novel on-chip computing architecture denoted by MIComp by introducing fully efficient SWIPT for computing purposes. The system is theoretically modeled while the state space of the system obtained with nanoscale size coils and SMMs achieves 1010 to 1016 bits in each cycle and per mm3 volume of chip compared with the current transistor counts of on the orders of 109 per mm2. Furthermore, each MIComp cycle has ability to perform for multiple purposes consisting of computing operations, memory state implementations and on-chip communications. It promises a novel solution for communication, energy and space bottlenecks for on-chip computing design.

DOI 10.1145/3203217.3203281