Characterization of chemically modified thin films for optimization of metal CMP applications?

Name: Characterization of chemically modified thin films for optimization of metal CMP applications?
Author: Başım, Gül Bahar, Karagöz, Ayşe, Özdemir, Zeynep

İsim	Characterization of chemically modified thin films for optimization of metal CMP applications?
Yazar	Başım, Gül Bahar, Karagöz, Ayşe, Özdemir, Zeynep
Basım Tarihi:	2013
Basım Yeri	- Cambridge University Press
Konu	Biomaterial, Microstructure, Chemical reaction
Tür	Belge
Dil	İngilizce
Dijital	Evet
Yazma	Hayır
Kütüphane:	Özyeğin Üniversitesi
Demirbaş Numarası	0272-9172
Kayıt Numarası	c6f201ed-a788-4175-8687-a34b3fe49174
Lokasyon	Mechanical Engineering
Tarih	2013
Notlar	Due to copyright restrictions, the access to the full text of this article is only available via subscription.
Örnek Metin	Metal CMP applications necessitate the formation of a protective oxide film in the presence of surface active agents, oxidizers, pH regulators and other chemicals to achieve global planarization. Formation and mechanical properties of the chemically modified metal oxide thin films in CMP determine the stresses develop at the interfaces delineating the stability and protective nature of the chemically altered films on the surface of the metal wafer. The balance between the stresses built in the film structure versus the mechanical actions provided during the process can be used to optimize the process variables and furthermore help define new planarization techniques for the next generation microelectronic device manufacturing. In this study, the preliminary studies were concentrated on the very well established tungsten CMP applications and furthermore, titanium CMP applications were presented as a part of surface nano-structuring methodology for biomedical applications by stressing the synergistic effect of protective metal oxide film of titanium in this advanced application.
DOI	10.1557/opl.2013.876
Cilt	1560

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Characterization of chemically modified thin films for optimization of metal CMP applications?

Yazar Başım, Gül Bahar, Karagöz, Ayşe, Özdemir, Zeynep

Basım Tarihi 2013

Basım Yeri - Cambridge University Press

Konu Biomaterial, Microstructure, Chemical reaction

Tür Belge

Dil İngilizce

Dijital Evet

Yazma Hayır

Kütüphane Özyeğin Üniversitesi

Demirbaş Numarası 0272-9172

Kayıt Numarası c6f201ed-a788-4175-8687-a34b3fe49174

Lokasyon Mechanical Engineering

Tarih 2013

Notlar Due to copyright restrictions, the access to the full text of this article is only available via subscription.

Örnek Metin Metal CMP applications necessitate the formation of a protective oxide film in the presence of surface active agents, oxidizers, pH regulators and other chemicals to achieve global planarization. Formation and mechanical properties of the chemically modified metal oxide thin films in CMP determine the stresses develop at the interfaces delineating the stability and protective nature of the chemically altered films on the surface of the metal wafer. The balance between the stresses built in the film structure versus the mechanical actions provided during the process can be used to optimize the process variables and furthermore help define new planarization techniques for the next generation microelectronic device manufacturing. In this study, the preliminary studies were concentrated on the very well established tungsten CMP applications and furthermore, titanium CMP applications were presented as a part of surface nano-structuring methodology for biomedical applications by stressing the synergistic effect of protective metal oxide film of titanium in this advanced application.

DOI 10.1557/opl.2013.876

Cilt 1560